august 2012 ? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa8108 ? rev. 1.0.0 fsa8108 ? audio jack detection and configuration switch, supports volume up/down & send/end keys fsa8108 audio jack detection and configuration switch, supports volume up/down & send/end keys features detection audio plug connection volume up/down key press send/end key press v dd 2.7 to 4.5v v io 1.6v to v dd thd (mic) 0.01% typical ldo output for mic bias voltage 2.4v esd (iec 61000-4-2) 15kv operating temperature -40c to 85c package 12-ball wlcsp top mark g6 ordering information FSA8108BUCX applications ? cellular phones, smart phones ? mp3 and pmp (portable media player) description the fsa8108 is an audio jack detection switch for 3- or 4- pole accessories that detects the audio plug connection. the detection circuit monitors the microphone bias voltage to detect a volume up/down or s end/end key press. for system flexibility, the fsa8108 features an i 2 c port with registers to allow programmability of ac timing specifications. ? detects 3- or 4-pole audio accessories ? removes audio jack pop-and-click caused by mic bias ? detects key press: volu me up/down, send/end ? stuck send/end key recovery ? ldo output for mic bias voltage related resources ? for samples and questions, please contact: analog.switch@fairchildsemi.com . figure 1. typical application diagram
? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa8108 ? rev. 1.0.0 20 fsa8108 ? audio jack detection and configuration switch, supports volume up/down & send/end keys physical dimensions figure 14. 12-ball, 3x4 array, 0. 4mm pitch, 250m ball, wafer-le vel chip-scale package (wlcsp) nominal values bump pitch overall package height silicon thickness solder bump height solder bump diameter 0.4mm 0.586mm 0.378m m 0.208mm 0.260mm package drawings are provided as a service to customers considering fairchild component s. drawings may change in any manner wit hout notice. please note the revision and/or date on the drawing and contact a fairchild semi conductor representative to verify or o btain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packagi ng area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ . ordering information part number operating temperature range top mark package d e x y FSA8108BUCX -40 to +85c g6 12-ball, 3x4 array, 0.4mm pitch, 250m ball, wafer-level chip-scale package 1.56mm 1.16mm 0.18mm 0.18mm bottom view side views top view recommended land pattern (nsmd pad type) notes: a. no jedec registration applies. b. dimensions are in millimeters. c. dimensions and tolerances per asme y14.5m, 1994. d. datum c is defined by the spherical crowns of the balls. e. package nominal height is 586 microns 39 microns (547-625 microns). f. for dimensions d, e, x, and y see product datasheet. g. drawing filename: mkt-uc012acrev1. 0.40 0.40 0.80 1.20 ?0.2600.02 12x (x)0.018 (y)0.018 a b c d 123 2x pin 1 area 0.03 c e d a b 2x 0.03 c 0.05 c 0.625 0.547 c 0.3780.018 0.2080.021 seating plane d f f (?0.200) cu pad (?0.300) solder mask 0.40 0.80 1.20 0.40 0.005 cab
? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa8108 ? rev. 1.0.0 21 fsa8108 ? audio jack detection and configuration switch, supports volume up/down & send/end keys
? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa8108 ? rev. 1.0.0 22 fsa8108 ? audio jack detection and configuration switch, supports volume up/down & send/end keys
? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa8108 ? rev. 1.0.0 23 fsa8108 ? audio jack detection and configuration switch, supports volume up/down & send/end keys
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